Job description
Summary of Role:
We have a position for R&D IC Test Engineer working at both wafer and packaged die level. Primary duties will include development, characterization and validation of IC test program of semiconductor technologies and devices, as well as maintaining and improving data system scripts. Our semiconductor technologies are used in wide range of inkjet printing solutions eg consumer, commercial, industrial, life science and others.
Responsibilities:
Work with various functional teams eg circuit design, product engineering and vendor to design and develop test program on ATE (Automated Test Equipment) eg Teradyne, SPEA
Support and improve data transfer system includes building data configuration files
Ensure test solution robustness for sustainable production testing
Volume data analysis using statistical data analysis tools
New test hardware & software set-up, correlate and release to production
Define test hardware (wafer and packaged die) specification according to selected ATE system to ensure full test coverage
Verification of vectors for testing at wafer level
Yield improvement and test time reduction activities to improve testing quality
Follow industry trend and understand new product requirements to define IC test technology roadmap
Education and Work Experience:
Bachelor's or Master's degree in Electrical/Electronics Engineering
1 - 3 years experience in IC Test Engineering
Test program development & debug for digital / analog devices
Proficiency in programming/scripting in C++, Python, Perl, C#
Experience with product engineering activities eg yield improvement and test time reduction
Statistical data analysis tools such as JMP or similar
Knowledgeable in semiconductor fabrication, device testing and packaging
Ability to work independently as well as in a team environment
About HP
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